Learn the SMT Process

09/07/2021

SMT is a component surface mount technology . Which is the most popular technology and process in the electronic assembly industry. SMC/SMD is a Circuit assembly technology in which the SMC/SMD is installed on the Printed Circuit Board (PCB) or other substrate and welded together by reflow welding or immersion welding.


The machine we need use in SMT : PCB Loader, Barcode Spraying Machine, Solder Paste Printing Machine, Dispensing Machine, SPI(solder paste inspection machine), Pick and Place Machine, Reflow Oven, AOI(optical inspection machine), AXI(X-ray inspection machine), Retract Machine, Plate Machine 

The spare parts we need use in SMT : SMT feeder , Feeder cart , Motor , Nozzle , Filter , Driver , Laser


 

SMT production process

1. Program and adjust the placement machine

According to the BOM placement file provided by the customer, the coordinates of the position of the component are processed. Then carry out the first piece PCB board with the SMT chip processing data provided by the customer.

2. Printing solder paste

Printing the solder paste with a steel on the PCB pads of the electronic component SMD to prepare the solder for the components. The equipment used is Solder Paste Printing Machine (printing machine), which is located at the forefront of the SMT chip processing line.

3.SPI Testing

Solder paste detector, testing the PCB pad with or without less tin, leaking tin, poly tin and other undesirable phenomena.

4. Components SMD

The electronic component SMD is accurately mounted to a fixed position on the PCB. The equipment used is a Pick Place machine located behind the screen printing machine in the SMT production line. The placement machine is divided into a high speed machine and a general purpose machine. High-speed machine: used for attaching large pin spacing and small components. Universal machine: A component with a small pin pitch (tight pin) and a large volume.

5. High temperature solder paste melting

The main purpose is to melt the solder paste through high temperature. After cooling, the electronic component SMD is firmly soldered to the PCB board. The equipment used is a reflow oven located behind the SMT machine in the SMT production line.

6.AOI Testing

Automatic optical detector to detect the welding components after welding, such as displacement, air welding and so on.

7. Visual inspection

Key items of manual inspection and inspection: Whether the version of PCBA is a modified version; whether the customer requires components to use substitute materials or components of designated brands and brands; IC, diode, triode, tantalum capacitor, aluminum capacitor, switch, etc. Whether the direction of the component in the direction is correct; defects after soldering: short circuit, open circuit, false object, false welding.

8. Packaging

Qualified products will be tested and packaged separately. The packaging materials generally used are air bubble fillm , anti-static bags, electrostatic cotton, and blister disks.